Thermo-mechanical Reliability Analysis of Copper TSV
نویسندگان
چکیده
منابع مشابه
Evaluation of the Thermo Mechanical Reliability of PTH Copper in PCBs
The thermo mechanical reliability of plated through holes (PTH) in printed circuit boards (PCB) normally is determined by different tests (e.g. thermo cycle test (TCT), interconnect stress test (IST), highly accelerated thermal shock (HATS). During these tests the PTH Cu is exposed to stresses and strains which are below the tensile strength and the fracture strain, respectively, which leads to...
متن کاملFabrication and thermo-mechanical behavior of ultra-fine porous copper
Porous materials with ligament sizes in the submicrometer to nanometer regime have a high potential for future applications such as catalysts, actuators, or radiation tolerant materials, which require properties like high strength-to-weight ratio, high surface-to-volume ratio, or large interface density as for radiation tolerance. The objective of this work was to manufacture ultra-fine porous ...
متن کاملThermo-mechanical analysis of a coated cylinder head
This paper presents finite element analysis (FEA) of a coated and uncoated cylinder heads of a diesel engine to examine the distribution of temperature and stress. A thermal barrier coating system was applied on the combustion chamber of the cylinder heads, consists of two-layer systems: a ceramic top coat (TC), made of yttria stabilized zirconia (YSZ), ZrO2-8%Y2O3 and also a metallic bond coat...
متن کاملThermo Mechanical Analysis of Polypropylene/Calcium Carbonate Nano Composite using Thermo Mechanical Analyzer
Polypropylene is extensively used for varied applications due to its low cost, low density, high thermal stability and resistance to corrosion. Enhanced mechanical properties of Polypropylene can be achieved by mixing it with clays to form nanocomposites which increases its utility. Polypropylene Nano composites are formed by mixing polypropylene with calcium carbonate nano particles. This resu...
متن کاملTheoretical and Practical Aspects of Thermo Mechanical Reliability in Printed Circuit Boards with Copper Plated Through Holes
The thermo mechanical reliability of copper plated through holes (PTH) in printed circuit boards is normally determined by different tests e.g. thermo cycle test (TCT), interconnect stress test (IST) or highly accelerated thermal shock (HATS). During these tests the plated copper is exposed to stresses and strains which are below the tensile strength and the fracture strain, respectively, which...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Korean Welding and Joining Society
سال: 2011
ISSN: 1225-6153
DOI: 10.5781/kwjs.2011.29.1.046